O V E R V I E W 

This free one day technical presentation is dedicated to the subject of advanced technology and reliability. Presenters from Aqueous Technologies, Kyzen, Nordson Dage, and VJ Electronix will cover cleaning / defluxing processes, improving fault-finding and yields through X-Ray Technology, and rework of complex assemblies.


Michael Konrad
President, Aqueous Technologies

Mike Konrad has worked continuously within the electronics assembly equipment industry since 1985.  Mike is President of Aqueous Technologies Corporation, North America’s largest manufacturer of fully automated defluxing and cleanliness testing equipment.

Mike has served on the US Navy’s EMPF Manufacturers Committee in the late 1980’s and again at the present time, is presently a member of the SMT Magazine Editorial Advisory Board, IPC’s APEX Exhibitor’s Committee, and has published dozens of articles on cleaning and cleanliness testing in numerous industry publications.  Mike was a member of IPC’s Stencil Cleaning Task Group, contributing to IPC-7526 Stencil and Misprinted Board Cleaning Handbook, and is a current member of IPC’s 5-31 Committee for the upcoming IPC Cleaning Handbook. Mike was a speaker at the IPC / SMTA High-Performance Electronics Cleaning Symposium in 2008 and 2010 and has taught cleaning courses and workshops throughout the world.

 Tom Forsythe
Kyzen Corporation
Tom has personally been involved in Cleaning Technology for over 20 years. Since joining Kyzen in 1992, Tom has been personally involved in taking Kyzen from a start up to the industry leading, multi-national organization focused cleaning material technology that it is today. Tom is a graduate of the US Naval Academy, and also has an MBA from Boston University. He is a frequent author and sought after presenter on the topic of high technology cleaning at industry forums across the globe. An active IPC and SMTA member, Tom is currently serving as a Vice President and Member of the Board of Directors for the Global SMTA organization. Kyzen is a corporate member of both SMTA & IPC, and he has participated in well over 100 industry trade fairs throughout the world.

Keith Bryant
Global Sales Director X-ray Systems, Nordson DAGE
A qualified Production Engineer with over 20 years experience within the electronics industry, Keith is Chairman of the UK SMART Group and sits on its Technical Committee, a member of the SMTA, and the ICT. He was one of the driving forces in forming SMART Group South Africa and acts as liaison with the UK parent. Currently Global Sales Director for Nordson DAGE X-Ray Systems, Keith has presented technical papers on many subjects including Lead-Free Materials and Process, throughout Europe, Asia and the USA.

Don Naugler
President, VJ Electronix, Inc.
A leading supplier of SMT rework and x-ray inspection equipment. Don has 30 years of experience providing capital equipment and services to the electronics and semiconductor industries.  He has a BS in Mechanical Engineering from the University of Massachusetts and a Masters in Business Administration from Southern New Hampshire University. 


 Monday, July 9, 2012

9:00 AM - 3:15 PM
Lunch will be provided

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San Francisco Marriott Union Square
480 Sutter Street
San Francisco, CA 94108


Lisa Kocks
Aqueous Technologies, Kyzen, Nordson Dage, VJ Electronix


Advanced Technologies & Reliability Seminar

This free one day technical presentation is dedicated to the subject of advanced technology and reliability. Presenters from Aqueous Technologies, Kyzen, Nordson Dage, and VJ Electronix will cover cleaning / defluxing processes, improving fault-finding and yields through X-Ray Technology, and rework of complex assemblies.

Register today for this valuable free seminar!

This one-day technical workshop will answer many common questions about cleaning, x-ray, rework, and more.  The workshop is free but seats are limited.  Lunch will be provided.


Advanced Technologies
& Reliability Seminar

Aqueous Technologies – Kyzen - Nordson Dage -

VJ Electronix, Inc.

July 9, 2012

9:00 - 9:15

Welcome & Introduction:
Present background on presenters and the agenda for the day.

9:15 – 10:15

Michael Konrad - Aqueous Technologies
"Electrical Leakage, Dendritic Growth, and White Residue...
The Rush to Clean No-Clean"
Once commonplace, then relegated to military and other high reliability applications, today, defluxing has once again moved toward the mainstream.  The miniaturization of electronic assemblies and their components, implementation of lead-free alloys, combined with improved quality standards and higher reliability expectations have culminated to form a growing demand for ionicly clean electronic circuits. This paper will review the major causes of residue-related failures including dendritic growth, electrical leakage, and under-coating adhesion failures.  Why we clean and what we are removing, and how clean is clean will be presented.  

10:15 – 10:30


10:30 – 11:30

Tom Forsythe - Kyzen Corporation
"Cleaning technology Innovations Needed to Clean Highly Dense Assemblies"
As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.

Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries. 

Cleaning agents must be designed to remove strong covalent (hydrophobic) and weak ion (hydrophilic) bonds. Cleaning machines must be designed to move the cleaning agent to the source of the residue and either extract or create a flow channel to remove residues under component gaps. Recent solvent and aqueous cleaning agent and cleaning equipment innovations have been developed to bridge this gap. To achieve the process objective, cleaning agent and cleaning equipment suppliers collaborate with assemblers to develop improved cleaning processes. 

11:30 – 12:30


12:30 - 1:30

Keith Bryant - Nordson DAGE
"100 Years of X-Ray Advancement"
There have been numerous advances in terms of x-ray tube and x-ray detector technology in the last 100 years and these have been increasingly applied into helping with the manufacturing of electronic components and assemblies, as well as in their failure analysis. Most recently, this has been rapidly driven by the continued reduction in board, device and feature size and the movement to using newer, lower density materials within the structures, such as copper wire replacing gold wire as the interconnection material of choice within components. In order to meet these challenges and those in the future, there have been a number of recent key improvements to the vital components within x-ray systems. In particular, there is a new x-ray tube type that permits high magnification inspection at improved resolution, yet retains high tube power under these conditions, allowing good x-ray flux for inspection of the smallest features. There is also the availability of new and improved x-ray detectors (both image intensifiers and CMOS Flat Panels) that are now specifically designed for electronics applications, rather than hand-me-downs from the needs of the medical market, which are able to take best advantage of these tube developments.

1:30 – 1:45


1:45 - 2:45

Don Naugler - VJ Electronix, Inc.
"Overcoming Today’s Rework Challenges"
As electronic devices have evolved to become more powerful and complex, the value of circuit boards used has steadily increased.  The need to cut the cost of scrap, compounded by demand for quick turns and faster time to market, drive an increasing trend for rework.  Reworked assemblies are expected to meet the same quality requirements as first pass assemblies.  

We will look at some of the new challenges in rework of today’s complex assemblies such as Package on Package (PoP), Quad Flat No-lead (QFN), and Micro Passive (01005) components.  We will present techniques for removal and replacement of RF Shields common to portable devices.  And we will discuss new methods of reworking large Thermally Enhanced BGA and Plated Through Hole (PTH) connectors used in high end computing and networking applications.

2:45 - 3:15

Panel Discussion