iMAPS New England Chapter Technical Meeting March 12, 2019 

Richard Hollman, Principal Process Engineer, ASM NEXX

The trend towards heterogeneous integration in packaging has led to a rapid increase in the complexity of the package itself.  It has been suggested, on the basis of shrinking features, that fabrication for packaging is coming to resemble wafer fabrication.  While there is some truth to this, there are also unique new challenges involved in building the structures required for new package designs.  Several examples can be found in Cu plating, where it is necessary to build features both large and small, with a variety of aspect ratios and other novel properties.  A creative approach to Cu plating is required in order to develop manufacturing processes for the range of new structures now required.  We will show, for example, how principles developed to successfully fill TSVs are adapted to build other feature types.

Richard Hollman received his PhD in Physics from Stanford University.  He has worked in the electronics industry for over 30 years in a variety of process technologies, most notably lithography and ECD.  He is Principal Process Engineer at ASM NEXX in Billerica MA, a supplier of process tools serving the advanced packaging market.