iMAPS New England 

  46th Symposium & Expo

at Boxboro Regency Hotel & Conference Center

Boxborough, MA

"CONNECTIVITY ROCKS"
May 7, 2019

REVIEW THE PRELIMINARY TECHNICAL PROGRAM HERE

On-line Registration is now CLOSED

but onsite registration is available

The Exhibit Hall is nearly sold out but a few booths are available, CLICK BELOW or contact:

Michael Toro, Exhibits Chair

508-425-6917 or Michael.Toro@ametek.com

 

ALSO, in conjunction with the 46th Symposium

TJGREEN Courses At Boxborough Regency

May 6 - Pre Cap Visual Inspection per Mil-Std-883 

May 8 - Copper and Gold Wire Bonding

 
Date & Time: 
Tuesday, May 7, 2019
7:30 AM to 5:00 PM EDT

Location: 

Boxboro Regency Hotel & Conference Center  -  242 Adams Place, Boxborough, MA Phone:  978-263-8701

Ask for the iMAPS Symposium Rate or make reservations at  THIS LINK using iMAPS Symposium Rate Code: IMAP


Contacts: 

 

Matt Bracy
Registration Chair
P: 603-731-5631
E: matt@msdsales.com
 

Harvey Smith
Sponsorship Chair 
P: 508-826-6033
E: harvey@imapsne.org  

Michael Toro
Exhibitors Chair
P: 508-425-6917 
E: Michael.Toro@ametek.com

Dmitry Marchenko
iMAPS New England President
P: (978) 225-3299
E: dmarchenko@gmail.com

Technical Program

The iMAPS New England Symposium and Expo is a highly respected professional forum for Microelectronics & Packaging Technology in the Northeast.

Our 2019 Technical Chairs, Lee Levine & Dave Saums with their Session Chairs have developed an outstanding Technical Program.

Luncheon Keynote Address

“General Applications of AESA Radar Technology”

Gerald (Jerry) Charlwood, Director Lightwave Antenna Business Unit - MACOM

 

This Year's Session Topics & Chairs:

 

  • Printed Electronics - Mary Herndon - Raytheon IDC & Jim King - King Technologies
  • RF & Microwave; 5G Innovations and Microwave Emerging Technologies I - Tom Terlizzi - GM Systems & Dr. Chandra Gupta - Consultant
  • RF & Microwave; 5G Innovations and Microwave Emerging Technologies II - Stephen Bart, Invensense & Richard Morrison, Draper
  • Novel Packaging Applications - Jim Ohneck - LTS  & Rick Elbert - Cicor
  • Interconnects - Lee Levine, Process Solutions Consulting & William Boyce - SMART Microsystems
  • Photonics & Optoelectronics Packaging - Yi Qian, MRSI Systems & Jin Li, Cambridge Technology
  • Advanced Packaging - Frank Muscolino, Advanced Assembly Tech & Richard Hollman, ASM Pacific Technology
  • Interactive Dialogue Poster Session - Dipak Sengupta, Analog Devices - Retired , Dave Saums, DS&A LLC & Michael Johnson, MACOM

Our Symposium is made possible by the support of our sponsors and exhibitors

be sure to visit them in the Exhibit Hall.


On-Site Registration starts at 7:30 AM

Symposium begins at 8:30 AM

Exhibit Hall opens at 9:00 AM.

We look forward to seeing you on Tuesday, May 7, 2019