iNE 47th Symposium Floating Session A

September 22, 2020, 1:00-3:00 pm

via ZOOM

There is No-Charge for Attending ... But, Registration With a Valid E-Mail Address is Required..!!

"Interconnection Technologies"

Session Chair: Lee Levine, Process Solutions Consulting

Today’s Session, "Interconnection Technologies", will consider three aspects of interconnection assembly. Terry York, K&S , will discuss a new high-speed, high placement accuracy pick and place machine with impressive performance capabilities. Tom Green, TJG Associates, will explain oxidation of Ag epoxy die attach during Oxygen plasma cleaning, and how to mitigate the cosmetic blackened surface with subsequent Argon plasma treatment, returning the epoxy to its original appearance. Lee Levine, Process Solutions Consulting, will explore the mechanisms of ultrasonic welding processes. Understanding those mechanisms will enable you to improve wire bonding yields and troubleshoot process difficulties.

"Silver Epoxy Turns Black after an Oxygen Plasma Clean prior to Wire Bonding…but so what?"

Thomas Green, TJ Green Associates LLC

abstract

"High Accuracy Pick and Place Interconnection"

Terry York, Kulicke and Soffa Ind. Inc.

abstract

"Wire Bonding: The Ultrasonic Bonding Mechanism"

Lee Levine, Process Solutions Consulting, Inc.

abstract

SCHEDULE (times approximate)

12:45 PM Check-In to ZOOM Meeting using e-mailed instructions
1:00 PM Introduction - Michael Johnson and Dave Saums, SymposiumTechnical Chairs

There is NO Charge for attending this meeting however, you must register in advance. You will receive an acknowledgement immediately upon completing the registration form and then, just prior to the meeting, you'll receive an e-mail with log-in instructions, the URL and Password for the Session. We suggest installing the ZOOM Desktop App in advance.

If you don't receive e-mail instructions or have any questions/issues,

contact Harvey Smith: harveys@imapsne.org