Join us for a FREE one day workshop as five industry experts collaborate to present valuable solutions to the most challenging cleaning issues in the electronics assembly process!

When designing a printed circuit board, numerous factors affect board function and reliability with paste and flux selection requiring key consideration. Flux residues certainly impact board reliability regardless of the paste type. This presentation reviews available test methods performed by materials suppliers to ensure the selection of reliable chemistries with particular attention to compatibility with downstream processes.

ZESTRON
Current trends including miniaturized components, increased board density and reduced standoff heights are driving the need for precision cleaning. These issues compound the cleaning effectiveness in OA applications as water cleaning processes have reached their limitation for cleaning effectiveness. Failure to properly clean PCBs decreases product reliability resulting from dendritic growth, electrochemical migration and electrical leakage currents. This presentation discusses reliability issues, solutions, analytical methods, best practices, and case study results.

HENKEL
The demands on Electronics Assembly Materials continue to increase.  Technical and regulatory compliance requirements drive the need to develop new materials.  Understanding the chemical interaction between common SMT chemistries is key.  This presentation examines the compatibility between next generation conformal coatings and halogen free flux systems.  

AQUEOUS TECHNOLOGIES
How clean is clean? This discussion will focus on the various testing methods, their advantages and disadvantages, particularly as it relates to the ROSE test. Post reflow precision cleaning of PCBs includes equipment, cleaning agents and deionized water. This presentation reviews all cleaning process costs and ways to maximize value added for the most cost effective process.