High Reliability in Harsh Environment:

Balancing Durability and Costs

Electronics design for harsh environments of high-heat, shock and vibration continue to face the challenges of reliability, yet under ever greater pressure for better designs at shorter time to market. Growing complexities in functionality and supporting technology adds to the cost and burden of producing reliable products in reasonable time. The traditional cycle of design, test and fix, combined with gross over-designing is at odds with realizing an efficient design methodology.

Join us as we explore the latest strategies in virtual prototyping for electronic systems that reduce time to market and dramatically enhance reliability, all while helping to avoid over-designing. We will discuss the methods to mitigate manufacturing issues, optimize heat distribution and predict areas of physical failure, allowing you to design to a targeted product lifetime.

Presented by:

Greg Caswell, Senior Member of Technical Staff, DFR Solutions

Brent Klingforth, Senior Applications Engineer, Oasis Sales, Inc.

 

Topics discussed

• Reliability Modeling of Electronics Exposed to Harsh Environments
•  PCB CAD and Thermal Design: Thermal analysis at the CAD level and simulated heat distribution.
• DFX and manufacturability: Automatically enforcing custom manufacturing and assembly rules for specialized designs
• Beyond the board – modeling heat distribution at the mechanical system level

Register Now!