When

Wednesday, June 21, 2017 from 10:00 AM to 4:00 PM CEST
Add to Calendar 

Where

Marivaux Hotel Congress & Seminar Centre 
Boulevard Adolphe Maxlaan 98 1000
Belgium
 

 
 

Contact

Kirsten Smit-Westenberg 
EIPC 
31-464264258 
kwestenberg@eipc.org 
 

European PCB Designer Day June 21 2017 

The EIPC and FED are pleased to announce the European PCB Designer Day in Brussels, June 21st, 2017.

Design decisions have life-long project consequences not just for technical performance but with the choices made by the designer at the outset often determining project success or failure.

The Designer Day focusses on some of the more critical design factors including base material selection, performance modelling and testing, signal integrity, component layout tools and 3D structures and component embedding.

The programme is aimed at members of the PCB Design Community who wish to enhance their skills with a fact filled day presented by leading industry figures.

Programme
10:00-10:30 Registration


10:30-11:10
Design applications/Low Loss
Alun Morgan, EIPC European Institute for the PCB Community

11:10-11:50
Copper Roughness and how to account for it
How understanding the impact of copper roughness on insertion loss lets you make
intelligent high speed material choices
Martyn Gaudion, Polar Instruments

11:50-12:30
Safe Testing of Complex UUTs
The combination of increasingly complex electronic components and the requirement for smaller
PCBAs has lead to the need for more stringent test methodologies which not only identify board
level issues but protect the UUT from potential catastrophic damage at initial power up. We will
discuss potential causes and propose a solution to minimise the likelihood of PCBA scrappage.
Wayne Morgan, Eiger Design GmbH

12:30-12:45 Panel discussion

12:45-13:45 Lunch

13:45-14:25
Principles of EMC and High-Speed Signal behaviour on PCB
Simulation and controlling the creation and propagation of EM fields
Prof. Rainer Thueringer, FED & TH-Mittelhessen

14:25-15:05
The Proportional Land Dimensioning Concept
As electronic components are becoming ever smaller, optimized footprints are required for reliable
electronic assemblies - the New Proportional Land Dimensioning Concept is a solution for this
challenge.
Rainer Taube, TAUBE ELECTRONIC

15:05-15:45
3 Dimensional & embedded electronics – by example of real designs
Due to the need of miniaturisation in the medical sector implantable pcb assemblies have to be
shrinked more and more. A clever combination of different techniques helps to find a adequate
solution.
Michael Matthes, WITTENSTEIN cyber motor GmbH        

15:45-16:00 Panel discussion

16:00-16:10 Closing remarks

Download the detailed Programme here
Register online below or download the registration form here