O V E R V I E W 

Over the past twenty years, the electronic manufacturing industry has seen cleaning (defluxing) become more necessary and more challenging. Never before, has the removal of contamination from circuit assemblies been so important to a product's overall reliability. Increasing component and assembly densities, decreasing standoff heights, higher reflow temperatures, and increased reliability expectations have created a "perfect storm" that is driving manufacturers to seek cleaning solutions.

Experts from soldering materials, cleaning chemicals, cleaning and conformal coating equipment, and failure analysis companies will present valuable and technically relevant information.

Join us in Huntsville Alabama for a free one-day Cleaning and Reliability workshop. Five industry experts from Aqueous Technologies, Henkel, Kyzen, PVA, and STI Electronics join forces to present valuable solutions to today's most challenging cleaning and reliability issues.

This free workshop will be presented free of charge and lunch will be provided. Seating is limited so reserve your seat today.

P R E S E N T E R S:

Michael Konrad
Aqueous Technologies

Mike Konrad has worked continuously within the electronics assembly equipment industry since 1985.  Mike is President of Aqueous Technologies Corporation, North America’s largest manufacturer of fully automated defluxing and cleanliness testing equipment.

Mike has served on the US Navy’s EMPF Manufacturers Committee in the late 1980’s and again at the present time, is presently a member of the SMT Magazine Editorial Advisory Board, IPC’s APEX Exhibitor’s Committee, and has published dozens of articles on cleaning and cleanliness testing in numerous industry publications.  

Tom Forsythe
Kyzen Corporation
Tom has personally been involved in Cleaning Technology for over 20 years. Since joining Kyzen in 1992, Tom has been personally involved in taking Kyzen from a start up to the industry leading, multi-national organization focused cleaning material technology that it is today. Tom is a graduate of the US Naval Academy, and also has an MBA from Boston University. He is a frequent author and sought after presenter on the topic of high technology cleaning at industry forums across the globe. An active IPC and SMTA member, Tom is currently serving as a Vice President and Member of the Board of Directors for the Global SMTA organization. Kyzen is a corporate member of both SMTA & IPC, and he has participated in well over 100 industry trade fairs throughout the world.

Dave Edwards
Senior Technical Service Engineer 
Dave Edwards is a Senior Technical Service Engineer with Henkel Electronics Material LLC.  He has worked in the electronics material manufacturing industry for over 15 years. The last 10 years in technical service and applications. He has a broad knowledge of many materials and applications associated with electronics assembly processing.

Jon Urquhart
Director – Global Application Engineering

Jon Urquhart has been PVA's senior application engineer since 1993. Jon specializes in the processing of fluid materials in a production environment and is utilized by material manufacturers and end users alike to optimize their process and recommend efficient automated equipment and application solutions. Jon currently holds numerous patents for spray valve designs and coating machine configurations and is a renowned expert in the selective application of conformal coating materials with close to 20 years of applicable experience.

Marietta D. Lemieux
Analytical Lab Manager
STI Electronics
Marietta D. Lemieux, is the Analytical Lab Manager at STI Electronics with extensive experience in materials and failure analysis of electronic assemblies and other materials. With a B.S. in Analytical Chemistry and an M.S. in Biophysical Chemistry, Mrs. Lemieux has broad experience in R&D and the analytical field.


 Thursday, September 13, 2012

8:30 AM - 4:15 PM
Breakfast & Lunch will be provided

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Holiday Inn Huntsville-Research Park

5903 University Drive • Huntsville, Alabama 35806
Phone: (256) 830-0600
Toll Free: (800) 845-7275


Cleaning & Reliability Workshop

Once commonplace, the process of removing flux and other contamination from post-reflow circuit assemblies virtually disappeared in the latter part of the 20th century. Cleaning was replaced by the use of no-clean flux and the residues were commonly allowed to remain on the assembly.

Today, component and assembly miniaturization, higher temperature reflow profiles, and increased reliability expectations have combined to reduce the volume of allowable contamination acceptable on an electronic assembly. The removal of flux and other process residues and cleanliness testing are among the fastest growing yet least understood processes in electronic assembly industry today.

This one-day technical workshop will answer many common questions about cleaning, cleanliness testing, conformal coating, failure analysis, and other reliability related topics

The workshop is free and seats are limited.  A continental breakfast and lunch will be provided.

Register today for this valuable free seminar!


Cleaning & Reliability Workshop

Aqueous Technologies – Henkel Kyzen - PVA

STI Electronics

September 13, 2012

8:30 - 9:00

Registration and Breakfast

9:00 – 9:15

Welcome & Introduction: Present background on speakers and review the agenda for the day.

9:15 – 10:15

Michael Konrad - Aqueous Technologies
"Electrical Leakage, Dendritic Growth, and White Residue...The Rush to Clean No-Clean" 
Once commonplace, then relegated to military and other high reliability applications, today, defluxing has once again moved toward the mainstream.  The miniaturization of electronic assemblies and their components, implementation of lead-free alloys, combined with improved quality standards and higher reliability expectations have culminated to form a growing demand for ionicly clean electronic circuits. This paper will review the major causes of residue-related failures including dendritic growth, electrical leakage, and under-coating adhesion failures.  Why we clean and what we are removing, and how clean is clean will be presented. A cleaning equipment “roadmap” will be presented and will review various cleaning processes, modern equipment requirements, and environmental considerations.

10:15 – 10:30


10:30 – 11:30

Dave Edwards – Henkel
"Cleaning of No-clean & Water Soluble Solder Pastes, and Compatibility of Underfills / Conformal Coatings to Solder Flux Residues"

11:30 – 12:30


12:30 - 1:30

Tom Forsythe - Kyzen Corporation
"Cleaning technology Innovations Needed to Clean Highly Dense Assemblies
Abstract: As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is ever more necessary. Low residue no-clean residues did not require cleaning on assemblies with larger spacing between conductors. As the distance between conductors narrow, residues under component gaps pose a reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow temperatures. Traditional cleaning agents and cleaning equipment may not be able to remove these harder to clean flux residues from extremely small geometries.Increased circuit functionality is accomplished using bottom termination surface mount components. As components reduce in size, the distance from the board to the underside of the component reduces. Flux residues bridge conductors making cleaning highly difficult. One of the most challenging issues is the selection of an appropriate cleaning process that will clean flux residues under these extremely tight geometries. Cleaning agents must be designed to remove strong covalent (hydrophobic) and weak ion (hydrophilic) bonds. Cleaning machines must be designed to move the cleaning agent to the source of the residue and either extract or create a flow channel to remove residues under component gaps. Recent solvent and aqueous cleaning agent and cleaning equipment innovations have been developed to bridge this gap. To achieve the process objective, cleaning agent and cleaning equipment suppliers collaborate with assemblers to develop improved cleaning processes.

1:30 - 2:30

Jon Urquhart, PVA
"Modern Conformal Coating – Equipment & Techniques”
Discussions include how the coating process and equipment has evolved from hand and bulk spray automation to programmable automated equipment. Also included is a discussion on the latest advancements in machines, coatings, and processes. 

2:30 - 2:45


2:45 - 3:45

Marietta D. Lemieux, STI Electronics, Inc.
STI Electronics, Inc. will be covering several case studies focusing on ionic contamination and the effect that ionic residue has on electronic hardware.

3:45 – 4:15

Panel Discussion
All panelists available for questions and answers





For additional information, please contact:
Lisa Kocks