Welcome aboard from the Executive Committee
of iMAPS New England

As you may realize, IMAPS New England is the leading professional forum for the exchange of information on microelectronics and packaging technologies.

Our Society encompasses all engineering facets including design, materials, manufacturing, extreme environmental testing, application cross over and much, much more.

This year's Technical Program is managed by Senior Advisors: Tom Green of TJ Green Associates and Mike McKeown of Hesse Mechatronics US.  Both gentlemen have reached out to industry and the academic community and have built a Technical Program that will challenge your thinking and stimulate your engineering awareness.  Thirty six presenters set in seven sessions will project a finely tuned array of excellent information.

As important, a very special thank you extends to the highly recognizable companies that continue to support IMAPs New England through their speakers.  Encouragement comes from Lockheed Martin, Raytheon, Fairchild, IBM, Dupont, Cree, MIT/Brookhaven Labs and many many more.

Session topics include:

• Nano and MEMS
• RF/Microwave Innovations Part I and II
• Counterfeit Prevention & Mitigation Strategies
• Wire Bonding & Advanced Interconnect
• 2.5/3D Packaging Technologies
• Bumped Die Attached

Our Symposium is made possible by the support of our many fine exhibitors so be sure to stop in the Exhibit Hall and visit them.  We have re-configured the Exhibit Hall to handle our luncheon which will work to promote our robust networking environment.

For a detailed summary of our Presentations visit our website www.imapsne.org

Registration starts at 7:30AM and the Symposium begins early at 8:30AM sharp with the Exhibit Hall opening at 9AM.

We look forward to seeing you on Tuesday, May 6th, 2014

Michael T. Gervais

IMAPS New England Chapter President