AVS CMP User Group - 2015 Spring Meeting - 16 April 2015 

Theme: Advances in CMP Materials, Consumables and Tools. Badge pick up will begin at 12.30pm and program will begin at 1pm. The program will end at 5.30pm following which an optional facility tour may be arranged.

Confirmed Speakers:

1. J. Nalaskowski/T. Burroughs - SEMATECH/CNSE - “FEOL CMP Process and Consumables Characterization Vehicle for 14nm Node and Beyond”

2. H. J. Kim - Global Foundries - "Process optimization in post W CMP in-situ cleaning"

3. S. Brenner - CNSE - "Occupational Exposure to Nanomaterials: Assessing the Potential for Cutaneous Exposure to Metal Oxide Nanoparticles in a Semiconductor Facility"

4. M. Corbett - Linx Consulting  -  "CMP Cost Issues & Impact on Consumables for Memory and Logic"

5. D. Dickmann - Ferro Corporation  - "Advances in Ceria Slurries to Address Challenges in Fabricating Next Generation Devices"

6. H. A. Kwong - SEMATECH - "Out-gassing from III-V Wafer Processing”

 

 

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