Announcing the NextFlex (FHEMII) Harsh Node Industry Day December 8, 2015
Huntsville, AL
Auburn University is home to the NextFlex Harsh Environment
Node – a major node of the newly awarded Flexible Hybrid Electronics
Manufacturing Institute (FHEMII). NextFlex is an institute for advancing the manufacturing of Flexible Hybrid Electronics (FHE). AU has significant infrastructure for design and development of harsh environment electronics under CAVE3 Electronics Center established in 1999.
Goals of NextFlex and AU Harsh Node of NextFlex
The primary institute goal is to accelerate technology adoption into advanced products by developing and commercializing advanced manufacturing technologies. The institute will leverage the electronics
industry and the high performance printing industry, both well-established US industrial and academic areas of strength. The five FHE core manufacturing focus areas are included below:
What do Companies hope to gain from the Institute?
Companies engaging in partnership with the institute can do the following:
The industry day is focused on providing benefits to the following audience:
What are the outcomes of the Industry Day
Thank you for your interest. If you have any further questions please contact:
Pradeep Lall, Ph.D., M.B.A., ASME Fellow, IEEE Fellow
John and Anne MacFarlane Endowed Professor, Mechanical Engineering
Director, NSF-CAVE3 Electronics Research Center
Auburn University
334-844-3424 URL: www.eng.auburn.edu/users/lallpra/