"Taking Lead Out, Putting Plastic in BGA Solder Connections"
A Discussion of Polymer Core Solder Ball Technology
Speaker: Dr. Tom Marinis, Draper
Describing the technologies and comparing the performances of polymer core and solid solder balls.
Tom Marinis is a Distinguished Member of Technical Staff at Draper, working in the area of integrated electrical-mechanical systems. He was awarded a PhD in Material Science from Carnegie-Mellon University in 1981 and went to work at Bell Labs in Allentown, Pennsylvania, developing thin and thick film technologies for power and filter products. In 1987, Tom transferred to AT&T's Merrimack Valley facility and helped implement high volume flip chip assembly for switching products. Tom joined Draper Laboratory in 1995, working on packaging MEMs inertial sensors and fabrication of high density multichip modules. He is a Fellow of IMAPS and a past president of the IMAPS New England Chapter.
Event Body
|
Event Body
|
SCHEDULE (times approximate)
5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Dinner
7:15 PM Technical Presentation
PRE-REGISTRATION DEADLINE IS THURS, April 7!
To cancel, e-mail Matt Bracy matt@msdsales.com by 3:00 p.m. on Monday, April 11, if we don't hear from you, the Chapter will pay for your meal and we will charge you for your registration.
For special dietary requirements e-mail Matt Bracy matt@msdsales.com