April 15, 2021, 11:00 AM-1:30 PM EDST
via ZOOM
There is No-Charge for Attending ... But, Registration With a Valid E-Mail Address is Required..!!
Session D
"Advanced Packaging"
Session Chair
Richard Hollman
Program Summary
"SiC Challenges and Uses in Electrification"
Frank Muscolino, Advanced Assembly Tech
“2.5D and 3D Integration Technology and Application”
Robert Patti, NHanced Semiconductors
“Uptake Capacity and Rate of H2Getters for Effectively RemovingOutgassed H2 Gas from Microelectronic Packages”
Hua Xia & David DeWire, Hermetic Solutions Group
SCHEDULE (times approximate)
10:45 AM Check-In to ZOOM Meeting using e-mailed instructions
11:00 AM Introduction - Michael Johnson and Dave Saums
There is NO Charge for attending this meeting however, you must register in advance. You will receive an acknowledgement immediately upon completing the registration form and then, just prior to the meeting, you'll receive an e-mail with log-in instructions, the URL and Password for the Session. We suggest installing the ZOOM Desktop App in advance.
If you don't receive e-mail instructions or have any questions/issues
contact Harvey Smith: harveys@imapsne.org