When

Friday, October 8, 2021 from 11:00 AM to 12:30 PM EDT
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Contact

Carol Mills
3D Systems Packaging Research Center
561-676-4782
carol.mills@ien.gatech.edu

PRC Short Course on System Level Packaging

This 90 minute short course will discuss the importance of reliability for a system-level package, introduce the different failure modes commonly observed in chip- and board-level interconnections and finally, explore recent developments made to address these challenges.

Registration is closed. This event has already been held.


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