Chapter Virtual Meeting January 12, 2021

via WebEx

There is No-Charge for Attending ... But,

Registration With a Valid E-Mail Address is Required!!!

"Rheological Considerations in Characterization of Films for Advanced Packaging Applications"

Speaker: Michaela Connell, FUJIFILM Electronic Materials

Summary: In addition to filling and planarization, the next generation of dielectric materials is required to demonstrate high resolution capabilities along with excellent electrical and mechanical properties. Infilm applications it is therefore important to understand the best rheological properties to create the necessary flow for the package design, without altering the other properties of the film.

Speaker: Michaela joined Fujifilm Electronic Materials in 2017 after graduating from the University of Rhode Island with her bachelor’s degrees in Chemical Engineering French. Michaela is an Engineer at Fujifilm in the New Business Development group and has taken over as project leader for their dry film applications.

Full Abstract

SCHEDULE (times approximate)
                        4:45 PM          Check-In to WebEx Meeting using e-mailed instructions
                        5:00 PM          Meeting Begins - Richard Hollman, Technical Meetings Chair
                        5:10 PM          Technical Presentation: Michaela Connell,  FUJIFILM

There is NO Charge for attending this meeting however, you must register in advance. You will receive an acknowledgement and e-mail immediately upon completing the registration form and then, 1-3 days before the Meeting, you'll receive an e-mail with the URL and Password for the Meeting. You will be able to participate either via your Browser or by installing the WebEx Desktop App (preferrably in advance. 

If you don't receive e-mail instructions or have any questions/issues, contact Harvey Smith: harveys@imapsne.org