When

Thursday, August 21, 2014 from 1:00 PM to 2:00 PM EDT
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Where

ZESTRON - GotoMeeting

VA

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Contact

ZESTRON
ZESTRON
703-393-9880
infousa@zestron.com

Advanced Curriculum: "Technical Study: Cleaning Bottom Termination Components"

As one of the fastest growing package types within the electronics industry, Bottom Termination Components connect integrated circuits to printed circuit boards. However, the leads are located underneath the component body, thereby inhibiting cleaning after the soldering process. Learn how to define and validate the optimal cleaning process paramet

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