Cleaning and Reliability Workshop

Presented by

Over the past twenty years, the electronic manufacturing industry has seen cleaning (defluxing) become more necessary and more challenging. Never before, has the removal of contamination from circuit assemblies been so important to a product's overall reliability. Increasing component and assembly densities, decreasing standoff heights, higher reflow temperatures, and increased reliability expectations have created a "perfect storm" that is driving manufacturers to seek cleaning solutions.

Experts in cleaning equipment, cleaning chemicals, soldering materials, conformal coating, and failure analysis will present the latest best-practice, technically relevant information from their field of expertise. 

Join us in Thornton Colorado for a free one-day Cleaning and Reliability workshop. 

This workshop will be presented free of charge. A continental breakfast and lunch will be provided. Seating is limited and this event will "sell-out" so reserve your seat today.

A G E N D A

8:00 AM - 8:45 AM
Registration, Continental Breakfast, Networking 

8:45 AM - 9:00 AM
Welcome - Introduction of speakers - Agenda  

9:00 AM - 10:15 AM
Michael Konrad 
President
Aqueous Technologies
Michael Konrad will speak on the subject of modern contamination-related failures including electrical leakage, dendritic growth, and white residues and the resulting "Rush to Clean No-Clean".
Abstract: Once commonplace, then relegated to military and other high reliability applications, today, defluxing has once again moved toward the mainstream.  The miniaturization of electronic assemblies and their components, implementation of lead-free alloys, combined with improved quality standards and higher reliability expectations have culminated to form a growing demand for ionicly clean electronic circuits. This paper will review the major causes of residue-related failures including dendritic growth, electrical leakage, and under-coating adhesion failures.  Why we clean and what we are removing, and how clean is clean will be presented. A cleaning equipment “roadmap” will be presented and will review various cleaning processes, modern equipment requirements, and environmental considerations. A review of conventional and non-conventional cleanliness testing techniques will be presented as well as a review of the common question, "How Clean is Clean?".

10:15 AM - 10:35 AM
Break

10:35 AM - 11:35 AM
Brandon D. Judd 
Technical Support Engineer 
Indium Corporation
Impact of Exposing No-Clean Solder Paste Flux Residues to a Water Wash
Cleaning Cycle
Abstract: Many contract manufacturers, and even some OEMs, in the US and elsewhere, support both no-clean and water clean SMT assembly processes. It seems that, inevitably, an occasional error is made, and a product assembled with a rosin based no-clean solder paste is accidentally run through a water wash cleaning cycle. The end result is an assembly that has some or all of the flux residue remaining on the assembly, often evidenced by a milky white appearance of the flux residue. The question then arises as to the electrical reliability of the whitish residue and whether or not there is a way to fix the situation short of using a cleaning chemistry to fully remove the residue. This presentation is based on an experiment that used SIR (Surface Insulation Resistance) testing to address these issues. 

11:35 AM - 12:30 PM
Lunch

12:30 PM - 1:30 PM
Jigar PatelM.S.Chem.Eng.
Zestron 
Defluxing in a No-Clean & OA World
Abstract:  No-clean pastes are widely used within the electronics industry.  However, current trends including miniaturized components, increased board density and reduced standoff heights are driving the need for precision cleaning. Also, these issues compound the cleaning effectiveness of DI-water in OA applications as water cleaning processes have reached their limitation for cleaning effectiveness. Failure to properly clean PCBs decreases product reliability resulting from failure mechanisms such as dendritic growth, electrochemical migration and electrical leakage currents. This presentation discusses reliability issues, solutions, analytical methods, best practices, and case study results.

1:30 PM - 1:45 PM
Break

1:45 PM - 2:45 PM
Hal Hendrickson
Sales Director 
Nordson Dage
Title: Showing You Things You Can't See and Doing More With What You Can See
Abstract:  As the demands of  PCB and Micro Electronics increase because of higher density, smaller components and complex electronic structures, the need to be able to inspect these devices both Optically and with X-ray continues to increase.  Early detection and accurate analysis tools are absolutely necessary.  It is critical that the latest technology be applied to these vital processes. Nordson Inspection Products will discuss the various ways to identify errors and trouble shoot completed assemblies to help efficiencies in production and perform failure analysis on completed assemblies.  Through the application of a combination of the multiple light sources in the Optical Inspection process and the latest in X-ray technology we will discuss the options available for early detection of errors and identification of failures in both PCB and Micro Electronics. 

2:45 PM - 3:15 PM
Expert Panel Discussion / Group Q&A 

3:15
Adjourn