A warm welcome from the Executive
Committee of iMAPS New England

The iMAPS New England Symposium and Expo is the leading professional forum for the exchange of information on microelectronics and packaging technologies.

Our Society encompasses all engineering facets including design, materials, manufacturing, extreme environmental testing, application cross over and much more.

The 2015 Technical Chairmen, Tom Green of TJ Green Associates and Dmitry Marchenko of Microsemi, have reached out to colleagues in industry and academia to create a Technical Program that will provide a platform for learning about advances in microelectronics and packaging technologies, while also creating an opportunity for professional networking.

Thirty seven presenters set in eight sessions will cover a range of interesting, current topics in microelectronics and packaging. We extend a special thank you to the companies that continue to support iMAPs New England through their presentations, including Lockheed Martin, Vishay, Globalfoundries, Invensas, and many more.

This year’s session topics include:

• RF/Microwave Innovations Part I and II 
• 2.5 / 3D Packing Technologies 
• Wire Bonding and Advanced Interconnect 
• Printed Electronics 
• MEMS